Bond / Peel Tester

VPM Technology (Vertical Point Movement and Positioning)

CHINA Patent ZL201110157669.8 /ZL201110075750.1) US Patent Pending
  • FAST & SOFT TARGET CONTACT (5≈15 gram contact force).
  • AVOIDS any tilt occurring on the test sensor principal axis and eliminating the component force interference.

DGFT (Digital Force Technology)

  • Close loop digital force sensor cartridge with HIGH RESOLUTION (24bit) with 40k/s sampling rate
Bond / Peel Tester
  • COMPREHENSIVE SOFTWARE
  • SOFTWARE BUILD in with SPC SUPPORT
  • MULTIPLE DATA UOTPUT FORMAT WORD/EXCEL REPORTS
  • DATA PROCESSING and FAILURE STATISTICS REPORT
  • Unique Patented Technology
  • High Reliability
  • Windows Based OS
  • Proven Design
  • Low Cost of Ownership
  • High Precision and Dynamic Sensors
  • Modulated control system with nano-second response rate

STANDARDS :      MIL STD 883E       ASTM F1269       JEDEC JESD 22-B116       JEITA EIAJ ET-740       GJB54B-2005   Method   2011      GJB548B-2005 Method 2019