A failed component can provide a wealth of information.
Decapsulation is the first sequence in the destructive node of the semicon device failure analysis in which the die of an integrated circuit package is exposed for detailed inspection the most important requirements of this process are to maintain die functionality.
We at Gaotec Solutions provide this decapsulations service to who needs to decapsulate a component and does not have the right tool or the expertise.
With our laser decap and our automated acid rinse or ion free plasma, we had perfected this decap application to keep the die, wire bonds and bond pads intact whether made of Al, Au, Ag, or Cu., the overall functionality of the die is retained for further failure analysis.